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Si Wafer Thickness Monitoring System SF-3

Real-time measurement of Si wafer thickness at CMP or BG

Product

Feature
  • Non contact, non destructive measurement
  • Parameter setting after spectrum analysis
  • High speed real-time monitoring during CMP, BG
  • Measurement over interlayer such as protection film and window material
  • Multi layers analysis
  • Original analytical engine (Patent pending)
  • Original analytical algorism for thickness measurement (Patented)
  • Automatic mapping function for thickness distribution

 

Measurement item
  • Film thickness analysis (5 layers)

 

Application
  • Thickness measurement for Si wafer material
  • Grinding evaluation for silicon/ compound semiconductor
  • 1.3mm/ next generation 450mm wafer
  • 775㎛ 300mm wafer
  • TSV wafer (Si layer thickness measurement on via)
  • Other materials (SiO2, film)

Specification

Specification
Model SF-3
Measurement range 0.1μm ~ 10μm、15μm ~ 1000μm、10μm ~ 775μm*、50μm ~ 1600μm*
Reproduciblity < 0.01%
Measurement time 200μs(5kHz) ~
Light source semiconductor  laser
Spot size Min φ6μm
WD 10mm or longer
Size 123(W)×224(D)×128(H)mm

* Above can vary depending on each condition

Configuration

Configuration

 

SF-3Rθ

Suitable for thin* wafer measurement with high speed mapping function
(* less than 12 inch )

 

Features
  • High-speed mapping function with movable RΘ Axis
  • Compact mapping stage
  • Integrated into semiconductor process machine(Mapping model)
  • Image identification function for wafer (Orientation flat/notch)
  • Non contact, non destructive measurement
  • Total thickness measurement of bonded wafer (thin film bonding, Si thickness and substrate)
  • Thickness measurement of multi layers
  • Accurate positioning system for wafer surface with imaging function 

 

Specification
Model SF-3Rθ
Optics Optical Probe
Measurement thickness range 0.5 ~ 1600μm *
Movable axis
Measuring diameter φ6、φ9、φ500μm
Stage size φ300mm
Movable axis stroke R:±150mm、θ:360°
Wafer size < 300mm
Measurement time 61pt/60s
Maximum driving speed 150mm/s
Stage resolution < 10μm
Repetitive positioning precision < 50μm
Other Positioning System by imaging function
Adsorption Yes
Option Alignment, Loader

* depending on the spectrometer

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