Film Thickness Measurement Instrument
Optical Thickness Meter OPTM Series
Features
- All functions necessary for film thickness measurements are integrated in the head
- Highly accurate absolute reflectance measurement using microspectroscopy (thickness of multilayered film and optical constants)
- High speed measurement of less than 1 second per point
- An optical system which makes possible measurement with a wide wavelength range (UV to NIR) using microscopy
- Safety mechanism with area sensors
- Easy Analysis Wizard which allows anyone- even untrained operators, to carry out the analysis of optical constants without difficulty
- Software program includes macro functions for customization of the measurement sequence
- Various customizations are possible
- Complex optical constants can also be analyzed(multi-point analysis)
- 300 mm stage available
Measurement Applications
- Semiconductors
- Films
- Solar Cells
- DLC
- FPD
- Optical Components
Measurement Examples
- Oxide Films
- Nitride Films
- Photoresists
- AR Coatings
- Perovskite Films
- Various Optical Thin Films
Measurement Items
- Absolute Reflectance
- Film Thickness Analysis
- Optical Constants Analysis (n: Refractive Index, k: Extinction Coefficient)
Thickness Monitor FE-300
Features
- Wide film thickness range （1nm～1mm)
- Thickness measurement using reflection spectrum
- Compact and affordable without compromising high precision
- User friendly software interface.
- Analytical algorisms are Peak-Valley Method, Fast Fourier Transformation (FFT) Method, Non-linear Least-Squares Method and Optimization Method.
- Optical constant analysis (n: Refractive index, k: Extinction coefficient) with Non-linear Least-Squares Method
Measurement Targets
- Function film, Plastic
- Semiconductor, Compound semiconductor
- Surface treatment
- Optical materia
- FPD
- Others
Measurement Items
- Absolute reflectance
- Film thickness(Up to 10 layers)
- Optical constant(n: Refractive index, k: Extinction coefficient)
Spectrum Ellipsometer FE-5000 series
Features
- Ellipsometry measurement for both visible and ultraviolet-ray range (250 to 800nm)
- Nano-order thin film thickness
- Quick measurement using multi channel spectroscopy (over 400 ch)
- Angle adjustable mechanism for detailed analysis
- High operability with optical constant database and recipe registration function
Measurement Targets
- Semiconductor wafer
- Compound semiconductor
- FPD （flat panel display）
- New materials
- Optical thin films
- Lithography
Measurement Items
- Ellipso-parameters
- Optical constant analysis
- Thickness analysis
Si Wafer Thickness Monitoring System SF-3
Features
- Non contact, non destructive measurement
- Parameter setting after spectrum analysis
- High speed real-time monitoring during CMP, BG
- Measurement over interlayer such as protection film and window material
- Multi layers analysis
- Original analytical engine (Patent pending)
- Original analytical algorism for thickness measurement (Patented)
- Automatic mapping function for thickness distribution
Measurement Targets
- Thickness measurement for Si wafer material
- Grinding evaluation for silicon/ compound semiconductor
- 1.3 mm / next generation 450 mm wafer
- 775 ㎛ 300 mm wafer
- TSV wafer (Si layer thickness measurement on via)
- Other materials (SiO2, film)
Measurement Items
- Film thickness analysis (5 layers)
Built-in film thickness monitor FE-3
Features
- A film thickness measurement system based on the high precision spectral interferometry
- Fast Fourier Transformation (FFT) Method as an analytical algorithm (Patent No: 4834847)
- Variety of measurement optics using optical fiber
- Integratable for a wide variety of manufacturing equipments
- Real time thickness measurement
- Remote control and multi point measurement
- White LED light source - long life and high stability
Measurement Targets
- Optic film (Hard Coat, AR film, ITO…etc)
- FPD (resist, SOI, SiO2…etc)
Measurement Items
- Film thickness analysis for multi-layer film
Line-Scan Thickness Monitor™ In-line Type
Features
- Line scan method enables full-width and full-length film inspection without ` omission`
- Original design of both hardware and software
- As a manufacturer specializing in film thickness measurement, we can provide enriched support
- High precision measurement is possible (patented)
- High speed measurement is possible
- Resistant to fluttering
- Wide sample width (up to 10 m in the transverse direction)
Measurement Object
- Film Substrates
- Thin-Film Coatings on Films (AR, ITO, HC, etc.)
- Glass
- Functional Materials
- Medical Materials
Measurement Items
- Film Thickness (2D Map, MD and TD Trends)
Examples of Detectable Defects
- MD Streaks
- Cross-Web Bands
- Diagonal Non-Uniformities
- Chuck Marks
- Spot Defects
