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Optical Thickness Meter Optical Thickness Meter OPTM Series text

Redefining Film Thickness Measurement！
Measure Virtually Any Film Type with a Single Instrument.

Optical Thickness Meter OPTM Series
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Measurement Applications

  • Semiconductors

  • Films
  • Solar Cells
  • DLC
  • FPD
  • Optical Components

Measurement Examples

  • Oxide Films

  • Nitride Films
  • Photoresists
  • AR Coatings
  • Perovskite Films
  • Various Optical Thin Films

Measurement Items

  • Absolute Reflectance

  • Film Thickness Analysis
  • Optical Constants Analysis (n: Refractive Index, k: Extinction Coefficient)

Concept Behind the Development of OPTM

Conventional Approach
Different film thickness measurement methods were required for different materials.
Dedicated film thickness measurement instruments were required depending on the sample transparency, color, and geometry.
New Approach
Enables film thickness measurements across a wide range of film types and sample geometries.
The OPTM Series easily measures a broad range of samples, from transparent to colored materials. With its micro-spot measurement capability, a single instrument can accommodate a variety of sample shapes and geometries.

Challenges of Conventional
Film Thickness
Measurement Instruments

  • Different measurement targets require different instruments.
  • Specialized knowledge is required for measurement and analysis.
  • High-precision measurement is required for both thin and thick films.

With
OPTM Series,

Optical Thickness Meter OPTM Series image
Simpler, More Accurate Film Thickness MeasurementOne Instrument for Thin Films, Multilayer Films, and Diverse Measurement Challenges
Microspectroscopy enables fast, non-contact, and non-destructive film thickness measurement in microscopic areas. By analyzing both film thickness and optical constants, the instrument supports a wide range of applications, from R&D to quality control.
Figure 1. Optical Configuration of the Microspectroscopy System

Use Cases

Need a single film thickness meter for every location?

  1. Challenge 1Challenges in Measuring Thin and Multilayer Films

    High-precision analysis of multilayer film thickness and optical constants
    Measure the thickness of each layer in perovskite solar cells with a single instrument. Non-contact, non-destructive measurement enables quick and easy analysis.
    High-precision analysis of multilayer film thickness and optical constants

  2. Challenge 2Need Fast Measurement of In-Plane Film Thickness Distribution

    Non-Contact, Non-Destructive In-Plane Mapping Measurement
    High-speed autofocus enables film thickness measurement at 25 points across a wafer in under one minute.
    Non-Contact, Non-Destructive In-Plane Mapping Measurement

  3. Challenge 3Challenges in Measuring Uneven or Stepped Surfaces

    Supports measurement of wiring patterns with a micro-spot beam.
    With a minimum spot diameter of just 3 µm, measurements can be performed in ultra-small areas. In addition to TEOS/SiN/Si multilayer films, as shown in (1), the system can also measure patterned structures with 10 µm-wide trenches, as shown in (2).
    Supports measurement of wiring patterns with a micro-spot beam.

  4. Challenge 4Thickness Analysis of Ultra-Thin Films Can Be Challenging

    Accurate Optical Constants (n and k) Can Be Obtained Through Multi-Point Simultaneous Analysis
    When the film thickness (d) is 100 nm or less, measurement accuracy may decrease, making it difficult to determine the exact value of d. In such cases, multiple samples with different film thicknesses are measured and analyzed simultaneously under the assumption that they share identical optical constants (n and k). This approach, known as multi-sample simultaneous analysis, enables more accurate determination of n and k, allowing the film thickness (d) to be determined more precisely.
    Three Samples with Different Si-ITO Film Thicknesses

  5. Challenge 5Need to Measure Small Areas on Complex-Shaped Samples

    Micro-Optical System Enables Measurement of Extremely Small Areas
    Even on small and complex-shaped devices such as stents and balloon catheters, film thickness can be measured at specific locations. This enables verification based on actual measured values rather than estimates, providing more reliable and accurate thickness evaluation.
    3D Alignment Function Enables Automatic Detection of Microscopic Measurement Points
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Features

Solve All Your Film Thickness Measurement Instrument Challenges!

  1. Features 01 A Measurement Film That Goes Beyond Material Limitations

    The OPTM Series uses spectroscopic measurement based on optical interferometry to enable highly accurate film thickness measurement regardless of film type. It accurately measures ultra-thin films, multilayer films, color filters, and transparent substrates that are traditionally difficult for conventional film thickness systems to measure. In addition, accurate absolute reflectance measurements enable analysis of a material's optical constants, including the refractive index (n) and extinction coefficient (k).
    Comparison of measurement methods

  2. Features 02 Making Optical Constant Analysis More Accessible

    Making Optical Constant Analysis More Accessible The OPTM Series features user-friendly functions that simplify film thickness measurement and optical constant analysis, enabling accurate measurements with ease for applications that previously required extensive experience and expertise.
    Making Optical Constant Analysis More Accessible

  3. Features 03 Exceptional Inspection Speed and Accuracy

    Thanks to high-speed AF (Auto Focus), measurements can be completed in as little as 1 second per point. With the OPTM-A1 Series equipped with an automated XY stage, up to 25 measurement points across a wafer can be measured in less than one minute. By employing a lens and optical system free from chromatic aberration, the OPTM series achieves:
    • Film thickness repeatability of 0.1 nm
    • Reflectance repeatability of 0.4% to 0.8%
    (Maximum value of relative expanded uncertainty: 2.1σ/Ave)
    Film Thickness and Reflectance Repeatability Data

  4. Features 04 Additional Features

    • Supports multilayer films of up to 50 layers
    • Capable of measuring micro areas as small as 3 μm
    • Equipped with an Area Sensor Safety System
    • Includes various patented software technologies
    • Customizable macro functions for a wide range of measurement sequences
    • Compatible with wafer loaders and large substrates
    Loader and Large-Substrate Compatibility

Specifications

Type OPTM-A1 OPTM-A2 OPTM-A3
Wavelength Range 230 nm to 800 nm 360 nm to 1100 nm 900 nm to 1600 nm
Film Thickness Measurement Range* 1 nm to 35 μm 7 nm to 49 μm 16 nm to 92 μm
Sample Size** Max.200 mm × 200 mm × 17 mm
Spot Size Φ５, Φ10, Φ20, Φ40
Notes:
　For Automatic XY stage type
　*Values are SiO2 equivalent thickness.
　**Please contact us for consultation concerning the 300 mm stage.

Type Automatic XY
stage type		 Fixed frame type Built-in head type
Dimensions (W × D × H) 556 × 566 × 618 mm 368 × 468 × 491 mm 210 × 441 × 474 mm
90 × 250 × 190 mm*
Weight 66 kg 38 kg 23 kg
4 kg*
Maximum power consumption** 500 VA 400 VA
*Power supply unit **Select voltage at purchase （AC 90 -110 V or 200-240 V）
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