Thickness Measurement

This instrument enables extremely precise analysis of film thickness and optical constants by measuring absolute spectral reflectance of microscopic regions.
Non-destructive and non-contact thickness measurement can be carried out on multilayered films and various coating layers including films, wafers, and optical materials.
Measurement speed is as fast as 1 second / point. Software is easy to use even for beginner users analyzing optical constants.
 

This meter pursues user-friendliness in an uncomplicated manner with “one step operation” such as just placing a sample on the tray for quick analysis.

This meter aims to streamline the inspection process by easily measuring absolute thickness without a calibration curve, with high precision and with high resolution.

Due to our unique optical geometry being designed as compact, this meter carries out non-contact measurement with high precision of even opaque, rough surface and/or flexible samples.

This in-line monitor can measure film thicknesses across the full-width and full-length of film products during manufacturing.
By combining our unique spectral interference technology with our newly developed high-precision film thickness processing technology, a single monitor can measure film thicknesses as wide as 500 mm in the shortest interval of 0.01 seconds

This off-line monitor easily inspects film thickness unevenness ‘mura’ of the entire area of film for use in R&D and sampling inspection of production lines.
Entire area of film can be measured at high speed and with great precision.

A film thickness measurement system based on the high precision spectrophotometry features compact size and affordable price. Every necessary component is built in one body for stable measurement data. Although offered at affordable price, there is no compromise on accuracy and even optical constant analysis is possible.

Automatic angle adjusting mechanism in addition to the basic spectrum ellipsometry system enables high accurate film thickness measurement for variety of thicknesses. Detachable retarder and rotating analyzer also widens the scope of choices available to measure as well as improves the measurement accuracy.

Accurate multi-layer film thickness measurement which has characteristics of wavelength dependency

Real-time measurement of Si wafer thickness at CMP or BG